At the end of 2017, Mediatek left the market for high-end smartphone processors. The reason: the development was not worth it. Although the Helio X series had some good chips, the Helio X30, which was introduced last, was hardly used in smartphones. Now, however, Mediatek is making a comeback in the high-end segment and yesterday kicked off a new series of smartphone SoCs. This is called “Dimensity” and the first chip presented under the roof of the series is the Mediatek Dimensity 1000, which is manufactured with 7nm.
The Dimensity 1000 is not only the first Mediatek high-end processor for a long time, but also the first Mediatek SoC with an integrated 5G modem. In-house development for the sub-6 GHz range is used, which according to Mediatek is said to work significantly more efficiently than the modems of the competition. Specifically, one promises a lower energy consumption and associated reduced waste heat. 5G modems from Qualcomm, for example, had problems with overheating. The Dimensity 1000 also offers other highlights in the wireless sector. Mediatek offers dual SIM support for 5G and supports the bundling of two 5G connections of separate SIM cards for a higher bandwidth. In addition, it scores with the support of WiFi 6 (a / b / g / n / ac / ax) and Bluetooth 5.1.
The APU also supports the camera ISP with various AI functions. The latter can also handle camera sensors that deliver up to 80 megapixel resolution. Video encoding is supported for H.264 and H.265 (HEVC). When decoding, there is additional support for Google’s VP-9 and AV1.
Overall, the Mediatek Dimensity 1000 seems to be an interesting and competitive smartphone processor. It will be interesting to see how the solution will ultimately perform in benchmarks and how the comparisons with the competition from Qualcomm will be. The first devices with the new Mediatek SoC flagship should appear in the first quarter of 2020. One can assume that these will come from Vivo, Oppo, Xiaomi or Meizu.